GOLD ARRAY TECHNOLOGY (BEIJING), LLC
2Patents
2Active
2Granted
42Portfolio score
Filing activity: Jun 18, 2015 → May 25, 2021
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10399270B2 | Photo-curing 3D printer and 3D printing method | Physics | 7 | Active |
| US11584077B2 | Resin reservoir for photocuring for use in 3D printer and 3D printer | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.