High Connector Density, Inc.
1Patents
0Active
1Granted
26Portfolio score
Filing activity: Dec 14, 1999 → Dec 14, 1999
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6172895A | High capacity memory module with built-in-high-speed bus terminations | Physics | 70 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.