Hirotoshi Nishida
1Patents
0Active
1Granted
22Portfolio score
Filing activity: Oct 9, 1997 → Oct 9, 1997
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6036908A | Injection molding method for resin-sealed component | Electricity | 27 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.