Patent assignee · JP · COMPANY

Hitachi, Ind.

1Patents
0Active
1Granted
21Portfolio score

Filing activity: May 17, 1989 → May 17, 1989

Most-cited patents

PatentTitleAreaCited byStatus
US5084402A Method of fabricating a semiconductor substrate, and semiconductor device, having thick oxide films and groove isolation Emerging Cross-Sectional Technologies 3 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.