HODEI TECHNOLOGY, LLC
1Patents
1Active
1Granted
39Portfolio score
Filing activity: Aug 26, 2018 → Aug 26, 2018
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10317942B1 | Heat dissipating structures and mobility apparatus for electronic headset frames | Physics | 1 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.