MESA TECHNOLOGY CO., LTD.
3Patents
1Active
3Granted
43Portfolio score
Filing activity: Feb 23, 1981 → Mar 13, 2023
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4510017A | Testable tape for bonding leads to semiconductor die and process for manufacturing same | General | 19 | Revoked |
| US4407440A | Semiconductor die bonding machine | Electricity | 2 | Expired |
| US12431472B2 | Micro light-emitting diode device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.