Microelectronic Packaging, Inc.
4Patents
0Active
4Granted
26Portfolio score
Filing activity: Jun 29, 1989 → Dec 12, 1996
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5680685A | Method of fabricating a multilayer ceramic capacitor | Emerging Cross-Sectional Technologies | 29 | Expired |
| US5603147A | Method of making a high energy multilayer ceramic capacitor | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5808856A | High energy multilayer ceramic capacitor | Emerging Cross-Sectional Technologies | 10 | Expired |
| US5013347A | Glass bonding method | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.