Pliant Systems, Inc.
2Patents
0Active
2Granted
22Portfolio score
Filing activity: Feb 10, 1999 → Jun 2, 1999
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6313997A | Bump-configured, perforated-plate architecture for housing printed circuit boards without EMI leaks | Electricity | 5 | Expired |
| US6246699A | Centralized routing scheme for distributed cross-connect using synchronized address field | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.