SHENGYI ELECTRONICS CO., LTD.
1Patents
1Active
1Granted
38Portfolio score
Filing activity: Aug 11, 2020 → Aug 11, 2020
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12171057B2 | Manufacturing method for pcb with thermal conductor embedded therein, and pcb | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.