Teratech Components Limited
1Patents
1Active
1Granted
39Portfolio score
Filing activity: Oct 16, 2020 → Oct 16, 2020
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12136757B2 | MMIC device on a substrate and mounted within a waveguide block, wherein a metal foil layer extends from the substrate to form in part a through hole | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.