Virtual Integration, Inc.
1Patents
0Active
1Granted
24Portfolio score
Filing activity: May 5, 1999 → May 5, 1999
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6294407A | Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same | Electricity | 58 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.