Akihiko Ogawa
9Patents
3h-index
16Co-inventors
54Inventor score
Filing activity: May 8, 1998 → Feb 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6041840A | Vacuum lamination device and a vacuum lamination method | Electricity | 26 | Expired |
| US6469643B1 | Information processing system | Electricity | 5 | Expired |
| US8078419B2 | Polishing monitoring method and polishing apparatus | Performing Operations; Transporting | 4 | Active |
| US8454407B2 | Polishing method and apparatus | Performing Operations; Transporting | 1 | Active |
| US6738763B1 | Information retrieval system having consistent search results across different operating systems and data base management systems | Emerging Cross-Sectional Technologies | 1 | Expired |
| US11633828B2 | Substrate polishing system, substrate polishing method and substrate polishing apparatus | Performing Operations; Transporting | 0 | Active |
| US10625390B2 | Polishing apparatus and polishing method | Performing Operations; Transporting | 0 | Active |
| US10890899B2 | Method of semiconductor manufacturing apparatus and non-transitory computer-readable storage medium storing a program of causing computer to execute design method of semiconductor manufacturing apparatus | Emerging Cross-Sectional Technologies | 0 | Active |
| US9068814B2 | Polishing monitoring method, polishing apparatus and monitoring apparatus | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.