Allan M. Kennedy
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Nov 2, 2012 → Nov 2, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8736045B1 | Integrated bondline spacers for wafer level packaged circuit devices | Electricity | 7 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.