Allison G. Condie
6Patents
1h-index
24Co-inventors
43Inventor score
Filing activity: Jul 26, 2017 → Jan 3, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10987697B2 | Multi-layer curable compositions containing 1,1-di-activated vinyl compound products and related processes | Chemistry; Metallurgy | 3 | Active |
| US11583891B2 | Multi-layer curable compositions containing 1,1-di-activated vinyl compound products and related processes | Chemistry; Metallurgy | 1 | Active |
| US12410300B2 | Compositions containing thermally conductive fillers | Emerging Cross-Sectional Technologies | 0 | Active |
| US12065540B2 | Thiol-containing composition | Chemistry; Metallurgy | 0 | Active |
| US12384879B2 | Thiol-containing composition | Chemistry; Metallurgy | 0 | Active |
| US12005475B2 | Multi-layer curable compositions containing 1,1-di-activated vinyl compound products and related processes | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.