Bernardo Hernandez
5Patents
4h-index
8Co-inventors
42Inventor score
Filing activity: Feb 28, 1992 → May 6, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5244143A | Apparatus and method for injection molding solder and applications thereof | Electricity | 186 | Expired |
| US5263620A | Wirebond removal apparatus using alternating fluid stream | Emerging Cross-Sectional Technologies | 21 | Expired |
| US5669437A | High efficiency thermal interposer | Electricity | 6 | Expired |
| US5446261A | Solder application system using helix to control solder meniscus | Performing Operations; Transporting | 6 | Expired |
| US5915462A | High efficiency thermal interposer | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.