Bill Planey
1Patents
1h-index
—Co-inventors
19Inventor score
Filing activity: Jun 25, 2001 → Jun 25, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6528880B1 | Semiconductor package for power JFET having copper plate for source and ribbon contact for gate | Electricity | 33 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.