Boyd Finlay
1Patents
0h-index
2Co-inventors
16Inventor score
Filing activity: Jul 25, 2016 → Jul 25, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10186439B2 | Systems and methods for sensing process parameters during semiconductor device fabrication | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.