Bryan Pennington
5Patents
2h-index
17Co-inventors
44Inventor score
Filing activity: Nov 7, 2008 → Sep 6, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8308931B2 | Method and apparatus for electroplating | Electricity | 60 | Active |
| US8500983B2 | Pulse sequence for plating on thin seed layers | Chemistry; Metallurgy | 17 | Active |
| US10443146B2 | Monitoring surface oxide on seed layers during electroplating | Chemistry; Metallurgy | 1 | Active |
| US10358738B2 | Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step | Electricity | 0 | Active |
| US11208732B2 | Monitoring surface oxide on seed layers during electroplating | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.