Bubryong Lee
2Patents
0h-index
5Co-inventors
24Inventor score
Filing activity: Oct 22, 2018 → Apr 7, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10998303B2 | Method of manufacturing package-on-package device and bonding apparatus used therein | Electricity | 0 | Active |
| US11776946B2 | Method of manufacturing package-on-package device and bonding apparatus used therein | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.