C Mark Johnson
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Jun 29, 2011 → Jun 29, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8432030B2 | Power electronic package having two substrates with multiple semiconductor chips and electronic components | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.