Cecilia Martner
3Patents
3h-index
9Co-inventors
39Inventor score
Filing activity: Oct 14, 2003 → Apr 8, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7112961B2 | Method and apparatus for dynamically measuring the thickness of an object | Physics | 8 | Expired |
| US7355394B2 | Apparatus and method of dynamically measuring thickness of a layer of a substrate | Physics | 4 | Active |
| US7777483B2 | Method and apparatus for measuring a thickness of a layer of a wafer | Physics | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.