Chee Ching Yip
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Jun 15, 2004 → Jun 15, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7351611B2 | Method of making the mould for encapsulating a leadframe package | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.