Chenyan Bai
10Patents
0h-index
25Co-inventors
40Inventor score
Filing activity: Dec 3, 2013 → Oct 31, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12116507B2 | Solventless adhesive composition and method for preparing the same | Chemistry; Metallurgy | 0 | Active |
| US11542376B2 | Aqueous polyurethane dispersion | Chemistry; Metallurgy | 0 | Active |
| US12116447B2 | Adhesive composition | Performing Operations; Transporting | 0 | Active |
| US12157841B2 | Solventless adhesive composition process and laminate with same | Chemistry; Metallurgy | 0 | Active |
| US11667822B2 | Water-based adhesive compositions | Chemistry; Metallurgy | 0 | Active |
| US11015093B2 | Two-component solventless adhesive compositions and methods of making same | Chemistry; Metallurgy | 0 | Active |
| US9969916B2 | Aqueous polyurethane dispsersions | Chemistry; Metallurgy | 0 | Active |
| US11608457B2 | Two-component solventless adhesive compositions and methods of making same | Chemistry; Metallurgy | 0 | Active |
| US12312505B2 | Adhesive composition | Chemistry; Metallurgy | 0 | Active |
| US11498999B2 | Aqueous polyurethane dispersion adhesive compositions | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.