Chia-Fu Wu
6Patents
4h-index
14Co-inventors
50Inventor score
Filing activity: Apr 5, 1996 → Mar 18, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5603374A | Heat sink assembly for an integrated circuit | Electricity | 25 | Expired |
| US7719094B2 | Semiconductor package and manufacturing method thereof | Electricity | 20 | Active |
| US7579672B2 | Semiconductor package with electromagnetic shielding capabilities | Electricity | 14 | Active |
| US7999359B2 | Semiconductor package with electromagnetic shield | Electricity | 4 | Active |
| US9201947B2 | Methods and systems for media file management | Physics | 0 | Active |
| US8025377B2 | Ink cartridge | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.