Ching-Ning Yang
1Patents
0h-index
6Co-inventors
19Inventor score
Filing activity: Aug 19, 2019 → Aug 19, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11222785B2 | Method for depositing a metal layer on a wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.