Chris Haga
4Patents
2h-index
3Co-inventors
33Inventor score
Filing activity: Jun 18, 2004 → Sep 24, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7498203B2 | Thermally enhanced BGA package with ground ring | Electricity | 3 | Active |
| US7084494B2 | Semiconductor package having integrated metal parts for thermal enhancement | Electricity | 2 | Expired |
| US8053285B2 | Thermally enhanced single inline package (SIP) | Electricity | 1 | Active |
| US7612437B2 | Thermally enhanced single inline package (SIP) | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.