Chris Leitz
2Patents
1h-index
2Co-inventors
24Inventor score
Filing activity: Sep 21, 2011 → Apr 30, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9590130B2 | Thin film solder bond | Emerging Cross-Sectional Technologies | 1 | Active |
| US9178105B2 | Flexible monocrystalline thin silicon cell | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.