Colin March
2Patents
0h-index
2Co-inventors
18Inventor score
Filing activity: Aug 27, 2019 → Dec 23, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11257771B2 | High-performance integrated circuit packaging platform compatible with surface mount assembly | Electricity | 0 | Active |
| US11605583B2 | High-performance integrated circuit packaging platform compatible with surface mount assembly | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.