D. H. Moon
2Patents
2h-index
4Co-inventors
27Inventor score
Filing activity: Oct 21, 1998 → Sep 14, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6281568A | Plastic integrated circuit device package and leadframe having partially undercut leads and die pad | Emerging Cross-Sectional Technologies | 366 | Expired |
| US6455356B1 | Methods for moding a leadframe in plastic integrated circuit devices | Emerging Cross-Sectional Technologies | 48 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.