Daisuke Okaka
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: May 17, 1989 → May 17, 1989
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5084402A | Method of fabricating a semiconductor substrate, and semiconductor device, having thick oxide films and groove isolation | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.