Daizo Ichikawa
1Patents
0h-index
5Co-inventors
19Inventor score
Filing activity: Nov 22, 2013 → Nov 22, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9123795B2 | Method of manufacturing semiconductor wafers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.