Daniel Perttu
5Patents
3h-index
1Co-inventors
36Inventor score
Filing activity: Mar 12, 2013 → Oct 13, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9240373B2 | Semiconductor devices with close-packed via structures having in-plane routing and method of making same | Electricity | 6 | Active |
| US9224681B2 | CTE matched interposer and method of making | Electricity | 4 | Active |
| US9484293B2 | Semiconductor devices with close-packed via structures having in-plane routing and method of making same | Electricity | 3 | Active |
| US9355895B2 | Method of providing a via hole and routing structure | Electricity | 2 | Active |
| US9190356B2 | Semiconductor devices with close-packed via structures having in-plane routing and method of making same | General | 0 | Revoked |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.