Daniel Schnetzler
3Patents
2h-index
6Co-inventors
33Inventor score
Filing activity: Apr 8, 2005 → Nov 3, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8250742B2 | Die ejector | Emerging Cross-Sectional Technologies | 5 | Active |
| US7238593B2 | Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7719125B2 | Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips | Emerging Cross-Sectional Technologies | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.