Danny Echtle
3Patents
3h-index
4Co-inventors
36Inventor score
Filing activity: Mar 21, 1995 → Jan 14, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6016001A | Metal to amorphous silicon to metal anti-fuse structure | Electricity | 13 | Expired |
| US6444502B1 | Method for forming strapless anti-fuse structure | Electricity | 4 | Expired |
| US5493926A | Method of identifying a weakest interface where delamination is most likely to occur in a multi-layer dielectric film stack | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.