David Jacy
1Patents
1h-index
6Co-inventors
25Inventor score
Filing activity: Mar 31, 2006 → Mar 31, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7598153B2 | Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species | Electricity | 23 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.