Dieu Dinh
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Mar 13, 2002 → Mar 13, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6844631B2 | Semiconductor device having a bond pad and method therefor | Electricity | 89 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.