Dilip Misra
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Jun 27, 2003 → Jun 27, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6972152B2 | Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same | Emerging Cross-Sectional Technologies | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.