Ding-Da Hu
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Jul 26, 2004 → Jul 26, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7301239B2 | Wiring structure to minimize stress induced void formation | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.