Dingwei Xia
2Patents
0h-index
2Co-inventors
28Inventor score
Filing activity: Oct 4, 2002 → Jul 29, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9524885B2 | Apparatus for molding a semiconductor wafer and process therefor | Electricity | 0 | Active |
| US8791583B2 | Apparatus for molding a semiconductor wafer and process therefor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.