Fang-Chung Liu
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Dec 31, 2001 → Dec 31, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6696356B2 | Method of making a bump on a substrate without ribbon residue | Electricity | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.