Fengfeng Hu
1Patents
0h-index
7Co-inventors
19Inventor score
Filing activity: Sep 6, 2023 → Sep 6, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12113952B1 | Metasurface-based structured light 3D imaging system and method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.