Gann Keith
1Patents
1h-index
1Co-inventors
22Inventor score
Filing activity: Feb 22, 2005 → Feb 22, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7511369B2 | BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.