Gemin Li
4Patents
1h-index
14Co-inventors
37Inventor score
Filing activity: Aug 31, 2015 → Oct 30, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10431382B2 | Printed circuit board assembly having a damping layer | Electricity | 2 | Active |
| US11812216B2 | Method to reduce H-field coupling for E-noise and a kind of non-coaxial integrated earbuds | Electricity | 1 | Active |
| US11832428B2 | Battery with electromagnetic interference shielding | Electricity | 0 | Active |
| US12231839B2 | Method to reduce H-field coupling for E-noise and a kind of non-coaxial integrated earbuds | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.