George A. Erfe
1Patents
1h-index
8Co-inventors
25Inventor score
Filing activity: Nov 18, 1996 → Nov 18, 1996
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5877551A | Semiconductor package having a ground or power ring and a metal substrate | Electricity | 18 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.