Gorou Kitsukawa
6Patents
4h-index
3Co-inventors
46Inventor score
Filing activity: Jun 26, 2001 → Feb 22, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6831294B1 | Semiconductor integrated circuit device having bump electrodes for signal or power only, and testing pads that are not coupled to bump electrodes | Electricity | 41 | Expired |
| US7247879B2 | Semiconductor integrated circuit device having particular testing pad arrangement | Electricity | 10 | Expired |
| US7550763B2 | Semiconductor integrated circuit device and manufacture thereof | Electricity | 6 | Active |
| US7910922B2 | Semiconductor integrated circuit device and manufacture thereof | Electricity | 5 | Active |
| US8629481B2 | Semiconductor integrated circuit device | Electricity | 4 | Active |
| US7910960B2 | Semiconductor integrated circuit device with a fuse circuit | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.