Haidong Wei
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Dec 30, 2010 → Dec 30, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9349615B2 | SiP system-integration IC chip package and manufacturing method thereof | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.