Hanglim Lee
2Patents
1h-index
10Co-inventors
34Inventor score
Filing activity: Oct 21, 2019 → Jun 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11600593B2 | Die bonding apparatus and method and substrate bonding apparatus and method | Electricity | 1 | Active |
| US12387918B2 | Substrate processing apparatus and substrate processing method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.