Heewoo Park
2Patents
1h-index
2Co-inventors
27Inventor score
Filing activity: Aug 27, 2019 → Jun 17, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11049814B2 | Semiconductor device including a through contact extending between sub-chips and method of fabricating the same | Electricity | 2 | Active |
| US11658125B2 | Semiconductor device with a through contact and method of fabricating the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.