Inventor · Düsseldorf, DE

Heike Klein

4Patents
1h-index
7Co-inventors
27Inventor score

Filing activity: Oct 21, 2020 → Oct 21, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US11897671B2 Flat-shaped composite material, package sleeve and package with stress-relief panels Performing Operations; Transporting 1 Active
US12139310B2 Flat-shaped composite material, package sleeve and package with curved edges Performing Operations; Transporting 1 Active
US11912473B2 Package with curved edges Performing Operations; Transporting 0 Active
US12129085B2 Package with stress-relief panels Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.