Hideki Endou
5Patents
3h-index
10Co-inventors
43Inventor score
Filing activity: Aug 22, 2002 → Jul 25, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7180176B2 | Radiation plate and power semiconductor module IC package | Electricity | 8 | Expired |
| US6995204B2 | Thermoplastic resin composition | Chemistry; Metallurgy | 4 | Expired |
| US7498283B2 | Glass powder and resin composition comprising it | Chemistry; Metallurgy | 3 | Active |
| US7424236B2 | Controlling method for image forming apparatus | Physics | 2 | Expired |
| US6787226B2 | Chopped strands and molded product of unsaturated polyester resin BMC employing them | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.